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Carbide bonded Graphene Coating

Energy, Cleantech & Environmental
College of Engineering (COE)
Lee, L James
Huang, Wenyi
Yu, Jianfeng
Licensing Manager
Norris, Francis "Frank"

T2013-363 A facile approach for obtaining carbide-bonded graphene coatings on a variety of metallic and nonmetallic substrates.

The Need

Despite the many attractive features of graphene, the lack of atomic bonds between graphene and substrates and among graphene nanosheets has limited its potential applications. Although theoretical considerations predict that covalent bonds between graphene nanosheets would significantly improve structural integrity, it has remained a formidable challenge to experimentally realize covalent networks within the confined space between graphene nanosheets. Therefore, it is imperative to develop a robust approach for establishing atomically bonded graphene networks that are either bridged at the graphene nanosheets edges or linked via the graphene basal planes as well as for a strong bonding between the graphene coating and the substrate.

The Technology

Researchers at The Ohio State University, led by Dr. James Lee, have developed a facile approach to obtain carbide-bonded graphene coatings on a variety of metallic and nonmetallic substrates. The technology consists of vacuum-assisted thermal exfoliation and flotation of functional graphenes at elevated temperatures, followed by deposition on substrates and in situ formation of carbide bonds from silicon/silicon oxide radicals produced by thermal decomposition of silicone rubber. This opens up new avenues for many engineering applications of graphene.

Commercial Applications

  • Memory devices
  • Computing products
  • Thermal management products
  • Transparent display electrodes
  • Capacitors
  • Sensor technology
  • Structural materials


  • Young’s modulus and hardness higher than silicon and steel
  • Electrical and thermal conductivities better than natural graphite
  • Low surface friction
  • Excellent chemical corrosion resistance and anti-abrasion
  • Good cytocompatibility
  • Easy micro-patterning by microfabrication techniques
  • Attractive semiconductive and optoelectronic characteristics